IO Expander for XIAO combines the perfect design for Seeed Studio XIAO series and adds 16 extra I/Os, 2 power outputs, and a Grove IIC port. For extra output, GND, INTB, INTA, and RST pads are also provided with configurable I2C address enabling dual expansion boards to work together. All of these elements offer extra soldering capabilities, unlocking new possibilities for creative projects.y.
Feature
- Solder pads expansion board: Powered by the MCP23017, it provides solderable 16 extra IOs, 2 power output, 1 Grove IIC bus port, along with extra output pads, including GND, INTB, INTA, and RST
- I2C Interface with configurable address: Default I2C address is 0x21, but can be configured to 0x20, which allows dual expansion boards working at the same time
- Designed for Seeed Studio XIAO: Highly compatible with all XIAO series products, highly expand your current project
- Solder-friendly: Multiple solder pads, every function solderable, compatible with bread board
- Thumb-sized Compact Design: 21 x 17.5mm, adopting the classic form factor of XIAO, suitable for space limited projects like wearable devices
Description
The IO Expander for XIAO is a supplementary circuit board, optimized for the Seeed Studio XIAO series, that yields 16 extra IO and 2 power output connections for maximum device performance.
Running on the MCP23017, this IO Expander features IIC port transmission of 400 kHz, breaking out an extra 16 IO, each capable of outputting up to 25mA and configurable input pull up. Additionally, this board features 2 VCC and 2 GND power output, 1 Grove IIC bus port, GND, INTB, INTA, and RST output pads.
This board contains J1 and J2 pads for connecting the MCP23017 chip's RST, INTB, and INTA pins with the XIAO board's D6, D1, and D0 pins. Plus, the selectable I2C address allows for the connection of two IO Expander boards to any single XIAO board, giving users a total of 32 IOs for wide-ranging utilization.
The expansion board features Grove pads that are designed for connecting Grove modules using soldered Grove sockets. These pads are connected to the I2C bus, enabling seamless integration with compatible Grove modules.
It adopts XIAO 21 x 17.5mm compact design, everything is solderable and would be perfect for solder enthusiasts.
Application
- Wearable Devices
- Home Automation
- Robotics
- IoT Prototyping
- DIY Electronics
- Educational Projects
- Prototyping and Testing
- Custom Peripheral Integration
- Home DIY Projects
Hardware Overview
No. | Pad/Pin | Description |
0 | Standard XIAO Pads | These are the standard pads for connecting the XIAO microcontroller. |
1 | J1 pads | Allows connection between MCP23017's RST, INTB, and INTA pins to XIAO's D6, D1, and D0 pins |
2 | MCP23017 Chip | Main I/O expander chip, provides 16 additional IOs |
3 | J2 pads | For selecting the I2C address. Default is 0x21. Changing to 0x20 is possible by soldering |
4 | MCP23017 Output Pins | Output pins from MCP23017 chip, labeled PA0 to PB7, providing 16 IOs |
5 | Grove Pads | For connecting Grove modules via soldered Grove socket. Connected to I2C bus |
6 | VCC Pin | Output pin for powering other components |
7 | GND Pin | Output pin for grounding other components |
8 | Additional Output Pads | Extra output pads, including GND, INTB, INTA, RST. Can be soldered for use elsewhere |
Part List
IO Expander for XIAO | x1 |
Solderable Grove Port | x1 |
7-pin female header | x2 |
ECCN/HTS
| HSCODE | 8543909000 |
| USHSCODE | 8543708800 |
| UPC | |
| EUHSCODE | 8543709099 |
| COO | CHINA |
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